7016 CE/HCP4ADBA

Hybrid Ceramic Super Precision Bearings

7016 CE/HCP4ADBA Hybrid Ceramic Super Precision Bearings
7016 CE/HCP4ADBA Hybrid Ceramic Super Precision Bearings

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Part No.
Part No. 7016 CE/HCP4ADBA

Basic Information

System of measurement Metric
Weight 1.54 kg
Tolerance class P4A
Seal type Open
For load direction Angular Contact

Main Dimensions

Bore diameter 80 mm
Bore diameter tolerance -0.004mm to 0
Outside diameter 125 mm
Outside diameter tolerance -0.004mm to 0
Width 44 mm
Width tolerance -0.2mm to 0
Contact angle 15 °

Ball & Washer Dimensions

Ball diameter 11.112 mm
Ball quantity 25

Performance

Temperature range - 30°C to 110 °C
Radial dynamic load rating 12442 lbf
Radial static load rating 12600 lbf
Limiting speed 28 X 1000 rpm
Lubrication Lubricated
Matched arrangement Duplex Back-to-Back (DB)
Number of bearings in matched set 2
Universal matching bearing No (Standard)
Preload Extra light / Class A

Materials

Ring material Chrome Steel
Ball material Ceramic
Cage material Phenolic
Technical Drawings No drawings available at the moment, will be launched soon
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7016 CE/HCP4ADBA Bearing Product Overview & Core Advantages

The 7016 CE/HCP4ADBA is a precision duplex angular contact ball bearing set designed for demanding applications requiring exceptional rotational accuracy and rigidity. This back-to-back (DB) matched pair is preloaded to Extra Light (Class A) specifications, ensuring minimal axial and radial play for superior system stability. Its defining features include a P4A super-precision tolerance class and ceramic balls, which collectively enable high-speed operation, reduced friction, and extended service life. This bearing configuration is engineered to handle combined loads efficiently, making it an ideal choice for high-performance spindles and precision machinery.

Model Code Breakdown

Code Segment Technical Meaning
7016 Basic bearing series and size designation (80mm bore, 125mm OD).
C 15° contact angle.
E Optimized internal design for enhanced performance.
HC Hybrid Ceramic: Signifies the use of ceramic balls with steel rings.
P4A Super-precision tolerance class, exceeding standard ABEC 7/ISO P4 specifications for runout and dimensional accuracy.
DB Duplex Back-to-Back arrangement. Two bearings are mounted together to increase rigidity and moment load capacity.
A Specifies the Extra Light preload (Class A) applied to the matched set.

7016 CE/HCP4ADBA Bearing Structural Features & Performance Benefits

High Rigidity and Stability: The back-to-back (DB) duplex arrangement creates a wide, rigid support system that effectively resists moment loads and shaft deflection, which is critical for maintaining precision in machining and positioning applications.

Superior High-Speed Performance: The combination of a lightweight phenolic cage and low-density ceramic balls significantly reduces centrifugal forces, allowing for a high limiting speed of 28,000 rpm. This also results in lower operating temperatures and reduced vibration.

Enhanced Load Capacity: The 15° contact angle and optimized raceway geometry provide excellent capability for handling combined radial and axial loads simultaneously.

Extended Service Life and Reliability: Ceramic balls are harder, lighter, and more wear-resistant than steel, leading to dramatically longer fatigue life. They are also electrically insulating and less susceptible to lubricant degradation.

Precision Engineering: Manufactured to P4A super-precision tolerances, this bearing ensures minimal runout and exceptional rotational accuracy for applications where positioning repeatability is paramount.

7016 CE/HCP4ADBA Bearing Typical Application Areas

The 7016 CE/HCP4ADBA is specifically engineered for high-end, precision-driven industries, including:

  • Machine Tool Spindles: High-speed milling, grinding, and turning centers.
  • Precision Robotics: Arm joints and rotary actuators requiring high rigidity and accuracy.
  • Aerospace & Defense: Gyroscopes, radar systems, and other critical navigation equipment.
  • Medical Equipment: High-speed dental handpieces and imaging device rotors.
  • Semiconductor Manufacturing: Wafer handling robots and precision stages.
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